ICEAMST LOGO

International Conference on

Emerging Applications of
Material Science and Technology

IEEE Conference ID: #70617
Theme: Innovations in Electronic Materials: Advancing Technology for a Sustainable Future

Organised by RV College of Engineering, Bengaluru, Karnataka, India

Dates
17-19, December 2026
Venue
RVCE, Bengaluru
Submission Deadline
4 November 2026
Registration Deadline
12 November 2026

In Collaboration with

IEEE
IEEE EDS
RVCE
ICEAMST
Keynote Speaker
PKP

Dr. Prasanta Kumar Panda

Chief Scientist & Head, (Retd.) Materials Science Division,
CSIR-National Aerospace Laboratories,
Bangalore, India.

Dr. Kumar Prasannajit Pradhan

Indian Institute of Information Technology, India.
IEEE Electron Devices Society Member

Dr. S. Seetharamu

Central Power Research Institute, Bangalore, India.
Director, National Design and Research Forum

Scope

The International Conference on Emerging Applications of Material Science and Technology (ICEAMST 2026), scheduled to take place on 17-19, December 2026, at RV College of Engineering, Bengaluru, India, is set to be an exciting collaborative event in the dynamic landscape of material science and technology. This year, themed around "Innovations in Electronic Materials: Advancing Technology for a Sustainable Future," ICEAMST 2026 aims to be an interdisciplinary platform for researchers, scientists, and engineers in the field of material science and engineering. This conference intends to enable an interdisciplinary research collaboration, providing insights into state-of-the-art developments in nano electronics, sustainable technologies, and the multifunctionality, reliability, and scalability of electronic materials. ICEAMST 2026 not only showcases the latest research findings but also fosters a collaborative environment, encouraging participants to share the research discoveries and advancements. The conference invites professionals from diverse industries, including healthcare, aerospace, energy, and electronics, fostering discussions that will shape the future of material science and technology.

Join us in Bengaluru for a transformative experience, where the collective expertise of participants will contribute to the ongoing research on the sustainable and innovative future of materials science and technology.

About RVCE

Established in 1963 with three engineering branches namely Civil, Mechanical and Electrical, today RVCE offers 12 Under Graduate Engineering programmes, 16 Master Degree programmes and Doctoral Studies. Located 13 km from the heart of Bangalore City – the Silicon Valley of India, on Mysore Road. Sprawling campus spread over an area of 16.85 acres(16.43 guntas) set in sylvan surroundings. Provides an ideal ambience to stimulate the teaching-learning process, helping in bringing out skilled and disciplined Engineers. Rated one amongst the top ten self-financing Engineering Institutions in the country. Current annual student intake for Undergraduate Programmes & Post Graduate Programmes in Engineering is in excess of 1200. Highly qualified and dedicated faculty. Utilizes its expertise in various disciplines to conduct Research and Development for Industry and Defense establishments in the country.

Vision

Leadership in Quality Technical Education, Interdisciplinary Research & Innovation, with a Focus on Sustainable and Inclusive Technology

Mission
  • To deliver outocme based Quality education, emphasizing on experiential learning with the state of the art infrastructure.
  • To create a conducive environment for interdisciplinary research and innovation.
  • To develop professionals through holistic education focusing on individual growth, discipline, integrity, ethics and social sensitivity.
  • To nurture industry-institution collaboration leading to competency enhancement and entrepreneurship.
  • To focus on technologies that are sustainable and inclusive, benefiting all sections of the society.
Quality Policy

Achieving Excellence in Technical Education, Research and Consulting through an Outcome Based Curriculum focusing on Continuous Improvement and Innovation by Benchmarking against the global Best Practices.

Core Values

Professionalism, Commitment, Integrity, Team Work, Innovation

Important Dates

Conference Timeline

Final Paper Submission Deadline

4 November 2026

Registration Deadline

12 November 2026

Conference Dates

RV College of Engineering, Bengaluru

17-19, December 2026

Call for Papers

ICEAMST 2026 welcomes high-quality research papers addressing significant innovations and applications in material science. The topics of interest include, but are not limited to, the following tracks:

1

Track 1: Advanced Electronic Materials and Electronics

  • 2D and 3D materials for next-generation electronics
  • Layered materials for flexible and transparent electronic devices
  • Stretchable and biodegradable electronics
  • High-performance dielectric and piezoelectric applications
  • Transistors and memory architectures
  • Advanced signal and imaging technologies
  • Bio-inspired electronic systems
  • Edge computing and AI-integrated embedded devices
  • Quantum materials for future electronics
  • MEMS and NEMS innovations
  • Advanced satellite and deep-space communication materials
  • 5G and 6G-ready electronic circuits and architectures
  • High-speed photonic and optoelectronic systems
  • Terahertz and sub-terahertz communication materials
  • Nanoelectronic sensor applications
2

Track 2: Sustainable Materials and Communication Technologies

  • Energy-harvesting materials for smart electronics
  • Self-repairing and bio-degradable electronic components
  • Circular economy and sustainable electronic waste management
  • Next-gen VLSI and ULSI eco-friendly architectures
  • High-efficiency RF and microwave materials
  • Advanced remote sensing technologies
  • AI-driven material design for green communications
  • Smart grid innovations with sustainable materials
  • Robotics and drone-based environmental monitoring
  • Secure and reliable communication protocols
  • Computational methods for sustainable material synthesis
  • Terahertz communication materials
  • AI-based misinformation detection in communication systems
3

Track 3: Materials for Control, Automation, and Industry 4.0

  • Intelligent materials for automation and robotics
  • AI-integrated sensor networks for industrial automation
  • Machine learning-driven adaptive control systems
  • Bio-compatible smart coatings for automation
  • Quantum-enhanced process control
  • Advanced AI-driven robotic applications in agriculture
  • Sustainable power electronics for electric mobility
  • High-efficiency autonomous vehicle materials
  • Smart materials for human-machine collaboration
  • Digital twin and cyber-physical systems in Industry 4.0
4

Track 4: Materials for Networking and Computing

  • Advanced photonic computing materials
  • AI-powered security materials for quantum networks
  • Future-proof materials for high-speed networking
  • Emerging substrates for 6G and beyond
  • Bio-inspired materials for secure information transfer
  • Edge computing hardware innovations
  • AI-driven networking topologies and architectures
  • AR/VR-assisted networking material advancements
  • Secure hardware-based cryptographic materials
  • Impacts of advanced networking materials
  • Low-latency materials for high-performance computing
5

Track 5: Applications of Material Science and Computing Technologies

  • Materials for next-gen biomedical implants and sensors
  • Hybrid material innovations for sustainable engineering
  • Emerging trends in smart material synthesis
  • AI-assisted material design and optimization
  • LiDAR and hyperspectral imaging material applications
  • High-speed computing materials for AI acceleration
  • Novel bio-mimetic materials for medical applications
  • AI-driven nano-material fabrication
  • Augmented and virtual reality-based material applications
  • Computational intelligence for material property prediction

Keynote Speakers

PKP

Dr. Prasanta Kumar Panda

Chief Scientist & Head, (Retd.) Materials Science Division,
CSIR-National Aerospace Laboratories,
Bangalore, India.

KPP

Dr. Kumar Prasannajit Pradhan

Indian Institute of Information Technology, India.
IEEE Electron Devices Society Member

SS

Dr. S. Seetharamu

Central Power Research Institute, Bangalore,India.
Director, National Design and Research Forum

AO

Dr. Azzeddine Oudjehane

Southern Alberta Institute of Technology, Canada

KJS

Dr. K.J. Sabareesaan

Nizwa College of Technology, Oman

MOO

Dr. Mario Orlando Oliveira

Engineering Faculty of National University of Misiones, Argentina.

Submission

 We welcome high-quality articles reporting unique and unpublished results of conceptual, experimental, and theoretical work or study in any of the topic areas mentioned in Call For Papers. When a manuscript is submitted, it suggests that it is not being considered for publication elsewhere.

Online Submission Form

Fill out the details below to submit your manuscript for peer review.

You can also submit your articles to iceamst@rvce.edu.in

General Paper Submission Guidelines

  • Paper submissions should be in MS-Word/PDF.
  • The article should be written in English; either American or British use is acceptable, but not both.
  • Papers which are simultaneously submitted to this conference and other events or publication venues as well as submissions that do not utilize the correct formatting template may not be accepted.
  • A paper should not include more than 6 authors. If included, a detailed description should be provided on the research contribution of each author to the paper.
  • All papers will be double-blind peer-reviewed and must fulfill the scientific standards of originality and academic ex
  • The submitting/corresponding author is responsible for ensuring that all other co-authors have authorized the article's publication and assumes responsibility for the manuscript throughout submission and peer review.
  • You will receive an email notification if you research work is accepted or rejected. Only the authors of the accepted paper can register to the conference.

The paper should be structured as follows:

  • Abstract
  • Purpose/Objectives
  • Methodology/Approach
  • Results & Findings
  • Conclusion & Future Scope
  • Acknowledgements (when appropriate)
  • References

Evaluation Process and Decision

  • All accepted papers submitted for publication will be checked with anti-plagiarism software to check the overlapping/similarity index of the content with already published material.
  • The papers with high overlapping/similarity index will be rejected strightaway.
  • All other submissions will be sent for double blind reviewed by the Program Committee on the basis of technical quality, relevance to the conference's topics of interest, originality, significance, and clarity.
  • Submissions failing to comply with paper formatting and allowed number of authors will be rejected without reviews.

Notification

The notification will be emailed to the author based on the reviewers' feedback. The Notification will be e-mailed to authors under any of the three categories

a. Accepted [Corresponding author will receive an official acceptance letter as an attachment with the Email]

b. May be accepted with minor/major changes

c. Rejected

Conference Policy and Ethics:

The authors should abide to the guidelines mentioned below before submitting the paper, if any dispute arises during peer review or after acceptance and publication and if authors are unable to give a valid explanation, ICEAMST 2026 retains the right to remove a submission from the editing process.

Articles submitted to the conference should provide new and previously unpublished research. In the academic context, adhering to ethical standards is important. As a result, any act of plagiarism will not be allowed. If an author is discovered to have plagiarized, the submission will be automatically rejected.

Registration

Registration fee details
EDS Member IEEE Member Non IEEE Member
Indian Authors 11,500 INR 12,500 INR 13,500 INR
Indian Listener 8,000 INR 9,000 INR 10,000 INR
Foreign Authors 130 USD 150 USD 170 USD
Registration fee includes,
Participation in the technical program, Lunch, Coffee/Tea Breaks, DVD Proceedings, Certificates, One Conference Kit for one registration (Conference Kit contents - Bag, Notepad, Pen etc.)

IEEE Ecopyright

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Conference ID: 70617X
Cancellation policy
After completing the registration process no refunds or cancellations are permitted.

Publication

IEEE Logo IEEE EDS Logo
XPLORE COMPLIANT ISBN: 979-8-3195-3043-1
DVD ISBN: 979-8-3195-3042-4
All registered and presented papers will be submitted for inclusion into IEEE Xplore.

Venue

RV College of Engineering
RV Vidyaniketan Post,
Mysore Road, Bengaluru,
Karnataka-560059, India

Contact Us

Contact person
Dr. Vikram N Bahadurdesai